Our engineering capabilities allow us to meet and exceed customer size, weight and power (SWaP) requirements by optimizing thermal cooling, enhancing power and I/O density and reducing board area. We engage at every phase of product development by providing design, manufacturing, assembly, test and packaging services, while our Electronic Manufacturing Services (EMS) team works closely with our customer partners to provide everything from circuit card design and assembly to complete turnkey solutions and testing. Target applications include RF electronics, antenna systems, radiation-hardened microelectronics, motion control solutions, electronic warfare subsystems, stabilized gimbals and positioners and communication and data link systems.