Cobham Advanced Electronic Solutions announces the appointment of Thomas Casale as Vice President and General Manager of its CNI and Interconnect Solutions Business Area
ARLINGTON, Virg. — Cobham Advanced Electronic Solutions (CAES), a sector of Cobham plc, today announced the appointment of Thomas Casale as Vice President and General Manager of its Communications, Navigation and Identification (CNI) and Interconnect Solutions Business Area (CIS), located in Exeter, New Hampshire and Huntington Beach, California.
“Tom brings over 30 years of experience in the RF and Microwave Industry to CAES,” said Shawn Black, President of CAES. “Because of his record of building successful organizations capable of strong execution and double-digit growth, we are confident that Tom will be able to drive our CIS Business Area to the next level.”
Prior to joining Cobham, Thomas Casale was President of L-3 Technologies ESSCO, an international radome design and manufacturing company. Under his direction, the company’s revenue doubled over a five- year period. Previously, Tom held numerous leadership roles at Crane Aerospace and Electronics as well as Signal Technology Microwave.
Tom holds a Bachelor of Science degree in Electrical Engineering from Worcester Polytechnic Institute, as well as two Master of Science degrees in Management and Electrical Engineering from Lesley University and Tufts University, respectively. In addition, Tom holds three U.S. patents related to signal generation/power management for cellular telephony and consumer appliances.
About Cobham Advanced Electronic Solutions
Cobham Advanced Electronic Solutions (CAES), the U.S. subsidiary of Cobham plc operating under a Special Security Agreement (SSA) with the US Department of Defense, provides a number of mission-critical and specialized solutions for harsh environments. Cobham Advanced Electronic Solutions supplies defense, aerospace, security, medical and industrial markets with critical solutions for communication on land, at sea, and in the air and space, by moving data through off-the-shelf and customized products and subsystems including RF, microwave, and high reliability microelectronics, antenna apertures and motion control solutions.